Zig-zag in-line package
id:
zig-zag-in-line-package-177-283877
title:
Zig-zag in-line package
text:
The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging. A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would
brand slug:
wiki
category slug:
encyclopedia
description:
Type of integrated circuit packaging
original url:
https://en.wikipedia.org/wiki/Zig-zag_in-line_package
date created:
2003-05-24T11:35:49Z
date modified:
2024-09-03T23:48:51Z
main entity:
{"identifier":"Q3776137","url":"https://www.wikidata.org/entity/Q3776137"}
image:
{"content_url":"https://upload.wikimedia.org/wikipedia/commons/a/a4/Ic-package-ZIP.svg","width":175,"height":175}
fields total:
13
integrity:
16