Wedge bonding
id:
wedge-bonding-304-8437333
title:
Wedge bonding
text:
Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry. Wedge bonding is directional, so the bonding head rotates to accommodate the different angles for bonding. Due to this rotation, wedge bonding is slower than ball bonding. The advantage of wedge bonding is a finer pitch is possible. Wedge bonding also accommodates the use of metal ribbon instead of wire for
brand slug:
wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Wedge_bonding
date created:
date modified:
2024-04-05T18:14:53Z
main entity:
{"identifier":"Q19600361","url":"https://www.wikidata.org/entity/Q19600361"}
image:
fields total:
13
integrity:
13