Wafer-level packaging
id:
wafer-level-packaging-165-8908310
title:
Wafer-level packaging
text:
Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components ar
brand slug:
wiki
category slug:
encyclopedia
description:
Means of packaging an integrated circuit
original url:
https://en.wikipedia.org/wiki/Wafer-level_packaging
date created:
2009-07-16T18:44:07Z
date modified:
2024-08-29T20:39:44Z
main entity:
{"identifier":"Q4017648","url":"https://www.wikidata.org/entity/Q4017648"}
image:
{"content_url":"https://upload.wikimedia.org/wikipedia/commons/3/3c/Samsung_Galaxy_Tab_2_10.1_-_Texas_Instruments_TWL6032-3960.jpg","width":2777,"height":2777}
fields total:
13
integrity:
16