Three-dimensional integrated circuit
id:
three-dimensional-integrated-circuit-161-9140867
title:
Three-dimensional integrated circuit
text:
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performan
brand slug:
wiki
category slug:
encyclopedia
description:
Integrated circuit composed of several vertically stacked chips
original url:
https://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit
date created:
2008-01-22T20:11:25Z
date modified:
2024-08-27T07:39:55Z
main entity:
{"identifier":"Q229370","url":"https://www.wikidata.org/entity/Q229370"}
image:
fields total:
13
integrity:
15