Thin shrink small outline package
id:
thin-shrink-small-outline-package-284-4255299
title:
Thin shrink small outline package
text:
The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.
brand slug:
wiki
category slug:
encyclopedia
description:
Thin Shrink Small Outline Package
original url:
https://en.wikipedia.org/wiki/Thin_shrink_small_outline_package
date created:
date modified:
2023-12-19T01:40:53Z
main entity:
{"identifier":"Q10382128","url":"https://www.wikidata.org/entity/Q10382128"}
image:
{"content_url":"https://upload.wikimedia.org/wikipedia/commons/8/82/TSSOP_16L.gif","width":350,"height":230}
fields total:
13
integrity:
15