Thermal design power
id:
thermal-design-power-178-6218571
title:
Thermal design power
text:
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.
brand slug:
wiki
category slug:
encyclopedia
description:
Amount of heat a computer's cooling system must dissipate
original url:
https://en.wikipedia.org/wiki/Thermal_design_power
date created:
2004-09-24T00:17:03Z
date modified:
2024-09-04T15:09:53Z
main entity:
{"identifier":"Q1053879","url":"https://www.wikidata.org/entity/Q1053879"}
image:
{"content_url":"https://upload.wikimedia.org/wikipedia/commons/2/25/AMD_heatsink_and_fan.jpg","width":1600,"height":1067}
fields total:
13
integrity:
16