Surface activated bonding
id:
surface-activated-bonding-202-7724483
title:
Surface activated bonding
text:
Surface activated bonding (SAB) is a non-high-temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces. High-strength bonding of semiconductor, metal, and dielectric can be obtained even at room temperature.
brand slug:
wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Surface_activated_bonding
date created:
date modified:
2024-04-04T21:07:28Z
main entity:
{"identifier":"Q25304871","url":"https://www.wikidata.org/entity/Q25304871"}
image:
fields total:
13
integrity:
13