Solder ball
id:
solder-ball-309-16085976
title:
Solder ball
text:
In integrated circuit packaging, a solder ball, also a solder bump is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps, since they are usually significantly smaller than the former. The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. A coined solder ball is a solder ball subjec
brand slug:
wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Solder_ball
date created:
date modified:
2023-03-13T21:32:36Z
main entity:
{"identifier":"Q25056816","url":"https://www.wikidata.org/entity/Q25056816"}
image:
{"content_url":"https://upload.wikimedia.org/wikipedia/commons/8/8a/Solder_ball_grid.jpg","width":3648,"height":2736}
fields total:
13
integrity:
14