Redistribution layer
id:
redistribution-layer-250-8457477
title:
Redistribution layer
text:
A redistribution layer (RDL) is an extra metal layer on an integrated circuit that makes its I/O pads available in other locations of the chip, for better access to the pads where necessary. When an integrated circuit is manufactured, it usually has a set of I/O pads that are wirebonded to the pins of the package. A redistribution layer is an extra layer of wiring on the chip that enables bond out from different locations on the chip, making chip-to-chip bonding simpler. Another example of the u
brand slug:
wiki
category slug:
encyclopedia
description:
Layer used to relocate a microchip's contacts
original url:
https://en.wikipedia.org/wiki/Redistribution_layer
date created:
date modified:
2024-02-14T00:44:58Z
main entity:
{"identifier":"Q7305977","url":"https://www.wikidata.org/entity/Q7305977"}
image:
fields total:
13
integrity:
14