Reactive bonding
id:
reactive-bonding-266-12658641
title:
Reactive bonding
text:
Reactive bonding describes a wafer bonding procedure using highly reactive nanoscale multilayer systems as an intermediate layer between the bonding substrates. The multilayer system consists of two alternating different thin metallic films. The self-propagating exothermic reaction within the multilayer system contributes the local heat to bond the solder films. Based on the limited temperature the substrate material is exposed, temperature-sensitive components and materials with different CTEs
brand slug:
wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Reactive_bonding
date created:
date modified:
2023-03-26T23:30:28Z
main entity:
{"identifier":"Q7300303","url":"https://www.wikidata.org/entity/Q7300303"}
image:
fields total:
13
integrity:
13