Plasma-activated bonding
id:
plasma-activated-bonding-236-5560750
title:
Plasma-activated bonding
text:
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE). Surface activation prior to bonding has the typical advantage that no intermediate layer is needed and sufficiently high bonding energy is achieved after annealing at temperatures below 400 °
brand slug:
wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Plasma-activated_bonding
date created:
date modified:
2021-01-29T22:10:07Z
main entity:
{"identifier":"Q7201760","url":"https://www.wikidata.org/entity/Q7201760"}
image:
fields total:
13
integrity:
13