Molded interconnect device
id:
molded-interconnect-device-302-6160001
title:
Molded interconnect device
text:
A molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part by selective metallization.
brand slug:
wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Molded_interconnect_device
date created:
date modified:
2021-10-13T14:50:05Z
main entity:
{"identifier":"Q1943354","url":"https://www.wikidata.org/entity/Q1943354"}
image:
fields total:
13
integrity:
13