Lead frame
id:
lead-frame-300-18151958
title:
Lead frame
text:
A lead frame is a metal structure inside a chip package that carries signals from the die to the outside, used in DIP, QFP and other packages where connections to the chip are made on its edges. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad. Small bond wires connect the die to each bond pad. Mechanical connections fix all these
brand slug:
wiki
category slug:
encyclopedia
description:
Metal structure inside a chip package that carries signals from the die to the outside
original url:
https://en.wikipedia.org/wiki/Lead_frame
date created:
date modified:
2024-03-01T03:42:09Z
main entity:
{"identifier":"Q16466835","url":"https://www.wikidata.org/entity/Q16466835"}
image:
{"content_url":"https://upload.wikimedia.org/wikipedia/commons/8/8b/TQFP_Leadframe.jpg","width":1800,"height":1350}
fields total:
13
integrity:
15