IEEE Rao R. Tummala Electronics Packaging Award
id:
ieee-rao-r-tummala-electronics-packaging-award-178-17459067
title:
IEEE Rao R. Tummala Electronics Packaging Award
text:
The IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components, electronic packaging or manufacturing technologies. The award may be presented to an individual or a team of up to three recipients. Recipients of this award receive a bronze medal, certificate and an honorarium.
brand slug:
wiki
category slug:
encyclopedia
description:
Annual award for contributions to electronic component manufacturing
original url:
https://en.wikipedia.org/wiki/IEEE_Rao_R._Tummala_Electronics_Packaging_Award
date created:
2009-06-15T13:44:04Z
date modified:
2024-09-04T17:19:15Z
main entity:
{"identifier":"Q15994996","url":"https://www.wikidata.org/entity/Q15994996"}
image:
fields total:
13
integrity:
15