Glass frit bonding
id:
glass-frit-bonding-253-7418681
title:
Glass frit bonding
text:
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting-point glass and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planariz
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wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Glass_frit_bonding
date created:
date modified:
2024-03-07T17:26:47Z
main entity:
{"identifier":"Q5567109","url":"https://www.wikidata.org/entity/Q5567109"}
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fields total:
13
integrity:
13