Direct bonding
id:
direct-bonding-288-16522520
title:
Direct bonding
text:
Direct bonding, or fusion bonding, describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.
These requirements are specified for the wafer surface as sufficiently clean, flat and smooth. Otherwise unbonded areas so called voids, i.e. interface bubbles, can occur. The procedural steps of the direct bonding process of wafers any surface is divided into wa
brand slug:
wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Direct_bonding
date created:
date modified:
2023-07-16T11:53:59Z
main entity:
{"identifier":"Q5280309","url":"https://www.wikidata.org/entity/Q5280309"}
image:
fields total:
13
integrity:
13