Die preparation
id:
die-preparation-249-14080163
title:
Die preparation
text:
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.
brand slug:
wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Die_preparation
date created:
date modified:
2024-02-16T00:20:46Z
main entity:
{"identifier":"Q5274495","url":"https://www.wikidata.org/entity/Q5274495"}
image:
{"content_url":"https://upload.wikimedia.org/wikipedia/commons/3/35/Mounted_wafer.jpg","width":320,"height":270}
fields total:
13
integrity:
14