Dicing tape
id:
dicing-tape-256-18550251
title:
Dicing tape
text:
Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication. The tape holds the pieces of the substrate, in case of a wafer called as die, together during the cutting process, mounting them to a thin metal frame. The dies/substrate pieces are removed from the dicing tape later on in the electronics manufacturing process.
brand slug:
wiki
category slug:
encyclopedia
description:
Special adhesive tape used during microchip manufacture
original url:
https://en.wikipedia.org/wiki/Dicing_tape
date created:
date modified:
2024-02-18T19:22:43Z
main entity:
{"identifier":"Q5272572","url":"https://www.wikidata.org/entity/Q5272572"}
image:
{"content_url":"https://upload.wikimedia.org/wikipedia/commons/5/5d/A_semiconductor_wafer_on_a_dicing_%28blue%29_tape._Few_chips_%28dies%29_from_the_wafer_have_already_been_picked_up_%28removed%29_for_further_manufacturing.png","width":671,"height":663}
fields total:
13
integrity:
15