Anodic bonding
id:
anodic-bonding-194-11122292
title:
Anodic bonding
text:
Anodic bonding is a wafer bonding process to seal glass to either silicon or metal without introducing an intermediate layer; it is commonly used to seal glass to silicon wafers in electronics and microfluidics. This bonding technique, also known as field assisted bonding or electrostatic sealing, is mostly used for connecting silicon/glass and metal/glass through electric fields. The requirements for anodic bonding are clean and even wafer surfaces and atomic contact between the bonding substra
brand slug:
wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Anodic_bonding
date created:
date modified:
2024-04-22T15:59:46Z
main entity:
{"identifier":"Q567503","url":"https://www.wikidata.org/entity/Q567503"}
image:
fields total:
13
integrity:
13